Molds for NIL, Thermal Embossing, & Photolithography

We offer a variety of nanopatterned and micropatterned molds for roll-to-roll and plate-to-plate UV nanoimprint lithography (UV NIL), thermal embossing, extrusion, and photolithography. Contact us if you would like more information or to discuss custom development.

Mold Specs

Materials: High-phosphorous nickel, copper, and aluminum. Seamless cylindrical photomasks are metal-coated glass or quartz.
Dimensions: Up to 6.5 inches in diameter and 6.5 inches long. Larger dimensions possible with equipment upgrade.
Form Factors: Flexible shims, seamless cylindrical drums, seamless cylindrical sleeves, and seamless cylindrical photomasks.

Flexible Shims for Batch Imprinting

Metal shims enable batch-scale testing using plate-to-plate nanoimprinters. Contact us for a list of in-stock metal shims.

Seamless Cylindrical Drums

Self-supporting molds can pattern films using roll-to-roll (R2R) processes like thermal embossing, UV nanoimprint lithography (UV NIL), and extrusion.

Seamless cylindrical sleeves

Thin sleeves that slide over mandrels in existing R2R setups offer thermal conduction that can be desirable for thermal embossing.

Seamless CYlindrical Photomasks

Seamless cylindrical photomasks enable R2R photolithography. The photomasks have UV-blocking regions with metal and UV-transparent regions without metal.

Feature Specs

Pitch: 200 nm to 8 microns demonstrated. Larger and smaller pitches possible with development.
Aspect Ratio: Up to about 0.7 (height:pitch).
Lattices: Square, hexagonal, and stochastic.
Shapes: Bumps, pillars, microlenses, pyramids, hierarchical features (nanofeatures on top of microfeatures), and more. SEM images of diamond dies and polymer replicas of our molds are shown below (molds will have inverted gender from SEM images).

Custom Development

Contact us to discuss custom development of master molds in the form of shims, seamless sleeves, and seamless cylinders for plate-to-plate and roll-to-roll nanoimprint lithography (R2R NIL), thermal embossing, and extrusion processes.